Altman Solon’s Joost Eyck is featured in Link Magazine discussing how advanced packaging is creating new opportunities across the semiconductor value chain, particularly as demand for AI and high-performance computing accelerates.
The article explores how the traditional divide between front-end and back-end semiconductor manufacturing is beginning to blur as chipmakers increasingly turn to advanced packaging, chiplet architectures, and system integration to improve performance. Joost explains why advanced packaging has become a strategic chokepoint, especially for AI, and highlights the opportunity this creates for equipment manufacturers and the broader Dutch and European semiconductor ecosystem.
Read the full article from Link Magazine.
